Hotmelt Moulding
The Low Pressure Molding – also known as low-pressure potting – is a process for encapsulating and protecting electrical and electronic components (such as printed circuit boards or sensors) from environmental influences such as moisture, dust, dirt and vibration.
The technique is also used to mold grommets and strain reliefs, for example for connectors. Low pressure molding mainly uses amorphous thermoplastic polyamides and polyolefins.
They combine a favorable viscosity spectrum with a wide application temperature range of -50 to 150 °C.
Hotmelt process
The potting material is heated until it is liquid (typically at 180-240 °C). The hot, liquid material is then introduced into a relatively cold mold at very low pressure, typically 5-25 bar.
The material flows smoothly into the mold cavity and around the electronics to be protected. Once the cavity is filled, replenishing material creates the preset pressure and reduces material shrinkage. At the same time, the cooling process begins as the material meets the outer walls of the molding potting cavity. A typical complete molding cycle takes 10 to 60 seconds.
Direct further processing is then possible without additional cooling or reactivation times.
Mold design
Due to our own mold design, we are very flexible and can implement almost all customer requirements.
Possible applications
• Molding of connectors
• Molding of ferrites
• Injection molding of cable grommets
• Injection molding of strain reliefs
• Injection molding of retaining devices